The manufacturing of Scint-X structured scintillators is divided into six main steps. All, except our proprietary scintillator deposition and filling process, rely on estabished industrial manufacturing techniques, used for example in production of silicon microelectronic circuits.

On an industrial scale, batch processing based on standard silicon wafers can therefore be utilized, enabling cost-efficient volume production of the commercial end product.

Characterization of components are done according to industry standards, with parameters such as Modulation Transfer Function and Signal to Noise Ratio.

For a more detailed description, please read our process and characterization information in pdf format: Technology-Process.pdf